Material Removal Mechanisms in Lapping and Polishing
Material Removal Mechanisms in Lapping and Polishing C. J. Evans1 (1), E. Paul2 , D. Dornfeld3(1), D. A. Lucca4(1), G. Byrne5(1), M. Tricard6, F. Klocke7(1), O. Dambon7, and B. A. Mullany8 1 Zygo Corporation, Middlefield, CT, USA 2Stockton College, Pomona, NJ, USA 3University of California, Berkeley, CA, USA 4 Oklahoma