ON Semiconductor Packaging and Labeling Guidelines


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ON Semiconductor Packaging and Labeling Guidelines
Version 1.0, 19-June 2017

Table of Contents
Definitions .................................................................................................................. 3 Labels......................................................................................................................... 4
MPN Label .............................................................................................................. 4 CPN Label .............................................................................................................. 5 Shipping Label ........................................................................................................ 6 Packing List & Certificate of Compliance ................................................................ 8 Packaging and Graphics .......................................................................................... 10 Integration ................................................................................................................ 11 Tape-and-reel (13”) packaging and labeling............................................................. 12 Tape-and-reel (7”) packaging and labeling............................................................... 14 WLCSP (7”-reel) packaging and labeling ................................................................. 16 Rails packaging and labeling.................................................................................... 18 Tray packaging and labelling.................................................................................... 20 Asia Hub Packing List .............................................................................................. 22

Definitions
 MPN Label: A bar code label containing the ON Semiconductor Manufacturer Part Number of the device and other traceability information. Label dimensions are 1.625" x 4.9" (41.3mm X 124.5mm).
 CPN Label: A bar code label containing the Customer part number of the device and other traceability information. Label dimensions are 1.625" x 4.9" (41.3mm X 124.5mm).
 Intermediate Box: The box that houses the reel or tube(s) containing product. Each Intermediate Box will have an MPN Label and a CPN Label when required.
 Shipping Label: A bar coded label used to identify the contents of a shipping container. This also contains a "ship to" name and address. Label dimensions are 4.5” X 6.5” (114.3mm X 165.1mm)
 Overpack Box: The box that contains one or more Intermediate Boxes. Each Overpack box will have a Shipping Label.

Labels
MPN Label
Each Intermediate Box will have a standard ON Semiconductor MPN Label. The label consists of the following elements:

Field Name/ Logo (1P) MPN * (1T) Lot* (9D) DTE*
(Q) QTY* (21L) ASSY LOC * (S) SERIAL NBR * CS ASSY IN MS LEVEL HOURS TEMP SEALED DATE HF RoHS
2LI e category
*--Barcoded Fields

Description
Manufacturer Part Number
Lot Number (maximum of 10 alphanumeric characters) Date Code(s) in “YYWW” format (“YY” denotes 2-digit year and “WW” denotes 2-digit work week; maximum of 2 date codes denoted as “YYWWYYWW”)
Quantity in container
Assembly Location Code (Internal to ON Semiconductor)
Internal to ON Semiconductor
Custom Source - 2-digit Country of Wafer Diffusion
Assembly In - Country of Assembly
Moisture Sensitivity Level Time period the product can be exposed to ambient room conditions
Maximum operating temperature of the product
Date when the moisture barrier bag is sealed
Halide Free Logo - Indicates if material is Halide Free
RoHS logo - Indicates if material complies with Europe RoHS Pb Free logo - Indicates if the material is Lead Free
Indicates type of second level interconnect plating The UL Recognized Component Mark - indicates if material is Underwriter Laboratories listed device China RoHS logo - Indicates if material complies with China RoHS

Sample of an MPN Label:

CPN Label
Each Intermediate Box will have a standard ON Semiconductor CPN Label when applicable. The label consists of the following elements:

Field Name (P) CUST PROD ID* (Q) QTY* (9D) DTE*
(2V) VDR* MPN (4L) COO* *--Barcoded Fields

Description
Customer Part Number
Quantity in container Date Code(s) in “YYWW” format (“YY” denotes 2-digit year and “WW” denotes 2-digit work week; maximum of 2 date codes denoted as “YYWWYYWW”)
Vendor code
Manufacturer Part Number
Country Of Origin

Sample of a CPN Label:

Shipping Label
Each Overpack will have a standard ON Semiconductor shipping label. The label consists of the following elements:

Field Name FROM SHIP TO MPN FO (3S) PKG ID *
(K) TRANS ID * (P) CUSTOMER PROD ID * (Q) Quantity * (13Q) Package Count
(S) Serial # *

Description ON Semiconductor return address Customer Name and Address Manufacturer Part Number Factory Order Number; Line item; Factory Order Sub Job ON Semiconductor UCC code, packing list number and three digit package number
Purchase Order Number Customer Part Number Package Quantity Which package out of the total number of packages in the shipment
Packing List number + which package out of the total number of packages in the shipment

COO ASSY
HF RoHS
2LI e category
*--Barcoded Fields

Country of Origin based on Assembly, with 2 digit ISO Country Code Halide Free Logo - Indicates if material is Halide Free RoHS logo - Indicates if material complies with Europe RoHS
Pb Free logo - Indicates if the material is Lead Free
Indicates type of second level interconnect plating The UL Recognized Component Mark - indicates if material is Underwriter Laboratories listed device

Sample of a Shipping Label:
ON Semiconductor Internal Use Only

Packing List & Certificate of Compliance
The Overpack box will contain a packing list detailing the contents of all Overpack boxes of an order. The Packing List contains ON’s standard Certificate of Compliance. The label consists of the following elements:

Tex t

Field Name Ship From Ship To Bill To Customer Code End Customer PO No. S/B F/O S/J L/L Purchase Order Date Manufacturer P.D. Date CSD
FOB
Terms Ship VIA PKG# Weight
Waybill Number
Lot Number Quantity Date Code Assembly Location Die Origin
(2V) Vendor ID
(11K) Packing List (4S) Package ID (K) Transit ID (P) Customer Prod ID (1P) Manufacturer Part Number (Z) Parcels
(2Q) Total Weight in KG
(Q) Quantity This Shipment (13D) Date Code

Description ON Semiconductor Return Address Customer's Name and Address Customer's Billing Address ON Semiconductor designated customer identifier Issuing Customer purchase order number Pick Bank Sales Order Sub Job (3 maximum deliveries; then prints multiple) Sales Delivery (3 maximum deliveries; then prints multiple) Purchase order issue date Manufacturer Planned Delivery Date Customer Schedule Date Freight On Board-Customer takes possession at the location specified Freight shipping terms (who pays for the freight) Carrier or freight forwarder Shipment package number Package weight in pounds and kilograms Shipper identification number for that shipment used for tracking Product manufacturing lot number Manufacturing lot quantity Manufacturing Dates Manufacturing Location Die Fabrication Location ON Semiconductor UCC number or Customer assigned Vendor Code Packing List number Vendor ID and packing list number Customer's purchase order number Customer Part Number
ON Semiconductor Part Number
Total box count
Total package weight of shipment in kilograms (weight in pounds listed above kg)
Package Quantity Product date code(s)

Bar Code and Text

CERTIFICATE OF COMPLIANCE
IT IS HEREBY CERTIFIED THAT ALL ARTICLES IN THE QUANTITIES AS CALLED FOR IN THE ABOVE PURCHASE ORDER ARE IN CONFORMANCE WITH THE REQUIREMENTS, SPECIFICATIONS AND DRAWINGS LISTED ON THAT ORDER WHICH HAVE BEEN ACCEPTED BY ON SEMICONDUCTOR IN WRITING. RECORDS SUBSTANTIATING THE ABOVE STATEMENT ARE AVAILABLE IN OUR FILES FOR INSPECTION BY AUTHORIZED PERSONNEL.
KEENAN EVANS, SENIOR VICE PRESIDENT, GLOBAL QUALITY AND RELIABILITY
EXPORT STATEMENT
THESE COMMODITIES, TECHNOLOGY OR SOFTWARE ARE SUBJECT TO ALL U.S. EXPORT CONTROL LAWS, INCLUDING BUT NOT LIMITED TO THE EXPORT ADMINISTRATION REGULATIONS. IT MAY NOT BE EXPORTED OR RE-EXPORTED TO DENIED ENTITIES OR TO ANY PROHIBITED PERSON, EMBARGOED COUNTRIES, OR FOR ACTIVITIES RELATED TO THE PROLIFERATION OF WEAPONS OF MASS DESTRUCTION, OR FOR ANY PROHIBITED USE WITHOUT PRIOR APPROVAL OF THE U.S. GOVERNMENT. DIVERSION CONTRARY TO UNITED STATES LAW IS PROHIBITED.

Packaging and Graphics
Shipments from ON Semiconductor will follow ON’s standard packaging process. The Overpack box may contain multiple Intermediate boxes of a single product. For each line item on an order that is shipped, there will be at least one overpack box [more if the quantity of intermediate boxes exceeds the capacity of the overpack box]. Any overpack box will contain one and only one part number, but may contain varying lots and date codes based on the content of the Intermediate Boxes.
Intermediate Box
MPN Label
Overpack Box
Shipping Label

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ON Semiconductor Packaging and Labeling Guidelines