Introduction to VLSI
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Baker Ch. 4 The Active and Poly Layers
Chapter 4
– The Active and Poly Layers
• Layout • Cross Sections • Connections • Design Rules • ESD
Introduction to VLSI
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
1
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
FOX-ACTIVE
DESCRIPTION
– FIELD OXIDE – EITHER LOCOS OR STI
• LOCAL OXIDATION OF SILICON • SHALLOW TRENCH ISOLATION
– SET BY
• DIFF AND TAP, AKA ACTIVE
– FOX = NOT ACTIVE
• SETS THIN VS. THICK OXIDE
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
2
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
FOX-ACTIVE
DESCRIPTION
– ACTIVE = DIFF.DG, TAP.DG – SELECT = NSDM.DG, PSDM.DG – NWELL = NWELL.DG
– SELECT AUTOMATICALLY PLACED – DIODE IS DIFF.DG
SUB NWELL
DIFF
TAP
FOM+NSDM= ACTIVE+NSELECT
FOM+PSDM= ACTIVE+PSELECT
FOM+PSDM= ACTIVE+PSELECT
FOM+NSDM= ACTIVE+NSELECT
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
3
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
ACTIVE, SELECT, NWELL
DESCRIPTION
– TRANSISTOR DEFINITION
• POLY OVER ACTIVE
– SELF-ALIGNED PROCESS
• SELF-ALIGNED GATE TO S/D • NEEDED TO ALIGN S/D TO GATE • GATE IS FORMED FIRST • IMPLANTS OCCUR AFTER GATE • GATE ACTS AS “HARD MASK”
– PLANAR FIELD/ACTIVE PROCESS
• STI GIVES PLANAR INTERFACE • STI/FOX FIELD ENHANCEMENT
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
4
POLY
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
DESCRIPTION
– SHEET RHO
• METAL ~ 0.1 OHMS/SQUARE • N+ POLY ~ 200 OHMS/SQUARE • P+ POLY ~ 400 OHMS/SQUARE • DIFFUSION ~ 100 OHMS/SQUARE
– SILICIDE
• REDUCE SHEET RHO
– ORDERS OF MAGNITUDE
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
5
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
GENERAL PROCESSING
DESCRIPTION
– NEED TO KNOW BASICS
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
6
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
CONNECTIONS
DESCRIPTION
– FLOW COMPARISON
• DIFF
ACTIVE/SELECT
• TAP
ACTIVE/SELECT
• LICON • LI • MCON • METAL1 • VIA
NA NA CONTACT METAL1 VIA1
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
7
Baker Ch. 4 The Active and Poly Layers
MOSFET LAYOUT
Introduction to VLSI
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
8
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
STANDARD CELLS
DESCRIPTION
– ROUTE POWER AND GND SAME – TOP HALF PMOS – BOTTOM HALF NMOS – ALL POWER/GROUND LINE UP – LAYOUT INCREASES HORIZONTAL – TRADEOFFS
• EASILY CONNECTIONS • LACK OF FLEXIBILITY
– DESIGN RULES
• LOOK AT drcRules FILE • GREP ON MIN • PIPE INTO GREP MET1
– DETAILED DOCUMENT ON RULES
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
9
ESD
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
DESCRIPTION
– ELECTROSTATIC DISCHARGE
• HBM – HUMAN BODY MODEL • MM – MACHINE MODEL
– SIMPLEST IS DIODE PROTECTION
• INPUT > VDD, D2 ON • INPUT < GND, D1 ON
– PHENOMENA IS THERMAL – NEED TO SHARE CURRENT – WHAT ISSUES ARE IN LAYOUT?
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
10
Chapter 4
– The Active and Poly Layers
• Layout • Cross Sections • Connections • Design Rules • ESD
Introduction to VLSI
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
1
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
FOX-ACTIVE
DESCRIPTION
– FIELD OXIDE – EITHER LOCOS OR STI
• LOCAL OXIDATION OF SILICON • SHALLOW TRENCH ISOLATION
– SET BY
• DIFF AND TAP, AKA ACTIVE
– FOX = NOT ACTIVE
• SETS THIN VS. THICK OXIDE
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
2
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
FOX-ACTIVE
DESCRIPTION
– ACTIVE = DIFF.DG, TAP.DG – SELECT = NSDM.DG, PSDM.DG – NWELL = NWELL.DG
– SELECT AUTOMATICALLY PLACED – DIODE IS DIFF.DG
SUB NWELL
DIFF
TAP
FOM+NSDM= ACTIVE+NSELECT
FOM+PSDM= ACTIVE+PSELECT
FOM+PSDM= ACTIVE+PSELECT
FOM+NSDM= ACTIVE+NSELECT
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
3
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
ACTIVE, SELECT, NWELL
DESCRIPTION
– TRANSISTOR DEFINITION
• POLY OVER ACTIVE
– SELF-ALIGNED PROCESS
• SELF-ALIGNED GATE TO S/D • NEEDED TO ALIGN S/D TO GATE • GATE IS FORMED FIRST • IMPLANTS OCCUR AFTER GATE • GATE ACTS AS “HARD MASK”
– PLANAR FIELD/ACTIVE PROCESS
• STI GIVES PLANAR INTERFACE • STI/FOX FIELD ENHANCEMENT
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
4
POLY
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
DESCRIPTION
– SHEET RHO
• METAL ~ 0.1 OHMS/SQUARE • N+ POLY ~ 200 OHMS/SQUARE • P+ POLY ~ 400 OHMS/SQUARE • DIFFUSION ~ 100 OHMS/SQUARE
– SILICIDE
• REDUCE SHEET RHO
– ORDERS OF MAGNITUDE
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
5
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
GENERAL PROCESSING
DESCRIPTION
– NEED TO KNOW BASICS
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
6
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
CONNECTIONS
DESCRIPTION
– FLOW COMPARISON
• DIFF
ACTIVE/SELECT
• TAP
ACTIVE/SELECT
• LICON • LI • MCON • METAL1 • VIA
NA NA CONTACT METAL1 VIA1
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
7
Baker Ch. 4 The Active and Poly Layers
MOSFET LAYOUT
Introduction to VLSI
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
8
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
STANDARD CELLS
DESCRIPTION
– ROUTE POWER AND GND SAME – TOP HALF PMOS – BOTTOM HALF NMOS – ALL POWER/GROUND LINE UP – LAYOUT INCREASES HORIZONTAL – TRADEOFFS
• EASILY CONNECTIONS • LACK OF FLEXIBILITY
– DESIGN RULES
• LOOK AT drcRules FILE • GREP ON MIN • PIPE INTO GREP MET1
– DETAILED DOCUMENT ON RULES
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
9
ESD
Baker Ch. 4 The Active and Poly Layers Introduction to VLSI
DESCRIPTION
– ELECTROSTATIC DISCHARGE
• HBM – HUMAN BODY MODEL • MM – MACHINE MODEL
– SIMPLEST IS DIODE PROTECTION
• INPUT > VDD, D2 ON • INPUT < GND, D1 ON
– PHENOMENA IS THERMAL – NEED TO SHARE CURRENT – WHAT ISSUES ARE IN LAYOUT?
Joseph A. Elias, Ph.D. Adjunct Professor, University of Kentucky; Modeling MTS, Cypress Semiconductor
10
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